发明名称 SOI semiconductor device and fabrication process thereof
摘要 A SOI semiconductor device comprises a resistor body which is formed of a top semiconductor layer in a SOI substrate having an embedded dielectric film and the top semiconductor layer formed on the embedded dielectric film and which is dielectrically isolated by an insulating film, wherein a resistance value of the resistor body is set to be a predetermined value by the concentration of impurities contained in the top semiconductor layer and by the dimension of the resistor body. <IMAGE>
申请公布号 EP1100126(A2) 申请公布日期 2001.05.16
申请号 EP20000309880 申请日期 2000.11.07
申请人 SHARP KABUSHIKI KAISHA 发明人 ADAN, ALBERTO OSCAR
分类号 H01L27/04;H01L21/822;H01L27/08;H01L29/8605;(IPC1-7):H01L27/12;H01L29/86 主分类号 H01L27/04
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