METHOD FOR MANUFACTURING FINE PATTERN OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a fine pattern of a semiconductor device is provided to prevent a lifting phenomenon of the fine pattern, by generating a footing under a photoresist pattern, and by eliminating the footing by a dry etch descum process. CONSTITUTION: Photoresist(12) is applied on a layer(10) formed on a semiconductor substrate, and a footing(16) is formed in a photoresist profile patterned by controlling the temperature of a soft bake. The footing of the photoresist profile is eliminated by using a dry etch descum process.