| 发明名称 |
METHOD FOR BONDING CERAMIC TO METAL AND BONDED BODY BETWEEN CERAMIC AND METAL BONDED BY THE METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding a ceramic to a metal without using an intermediate material and to obtain a bonded body between the ceramic and the metal. SOLUTION: This method for bonding the ceramic to the metal is characterized in that a bond face area at a metal side is <90% bond face area at a ceramic side in the bonding. |
| 申请公布号 |
JP2001130976(A) |
申请公布日期 |
2001.05.15 |
| 申请号 |
JP19990310931 |
申请日期 |
1999.11.01 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
MIYAMOTO SEIICHI;MARUYAMA TOSHIMASA;SATO TOSHIBUMI;ITOTANI TAKAYUKI;KOBAYASHI MINORU |
| 分类号 |
B23K1/19;B23K35/24;B23K103/04;B23K103/08;B23K103/12;C04B37/02;H01H3/32;H01H33/42;(IPC1-7):C04B37/02 |
主分类号 |
B23K1/19 |
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