SOLUTION FOR ACTIVATING COPPER AND METHOD FOR ELECTROLESS COPPER PLATING

摘要

PROBLEM TO BE SOLVED: To provide an activation solution for copper useful for electroless copper plating, which brings about the effects that plating reaction begins to start on the surface of the copper and the copper part is covered with a normal plated film immediately after a material to be plated is immersed into an electroless copper plating solution containing a Rochelle salt as a complexing agent, when the activation solution for copper is used. SOLUTION: The activation solution for copper is used before a material having copper at least at a part of the surface to be plated is subjected to electroless plating. The activation solution for copper contains a reducing agent and a surfactant and the pH of the solution is controlled to be 1 to 7 by using a pH-controlling agent.