| 摘要 |
PROBLEM TO BE SOLVED: To provide Sn system Pb-free solder which keeps conventional Sn-Cu system Pb-free solder's advantage and improves the defect of its heat cycle characteristics. SOLUTION: The heat cycle characteristics are improved by adding one or more kind of element from a group consisting of Mg, Al, Mn, Zn, La, Ta and Ce into Sn-Cu based alloy.
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