| 摘要 |
<p>PURPOSE: A polishing device is provided to reduce size and to surely prevent destruction of the components of the device resulting from contact and collision between the components. CONSTITUTION: A device is provided with a polishing table(22), a substrate holding means(24) which has a substrate holding member(42) for holding a substrate and pressing a polished surface of the substrate against a polishing surface of the polishing table(22) and a dressing means(26) for pressing a dressing member(50) against the polishing surface and dressing the polishing surface. In this case, the substrate holding means(24) and the dressing means(26) are positioned so as to interfere with each other in their moving paths.</p> |
