MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A molding apparatus for a semiconductor package is provided to reduce damage to a semiconductor package, by decreasing stress applied to the semiconductor package when the semiconductor package is separated from a molding die. CONSTITUTION: A molding apparatus has inner and outer dies, which face each other. An air spraying pipe(23) sprays air supplied from an air distributing apparatus(22) to a semiconductor package to separate the semiconductor package from the dies. An air supplying unit(21) receives a signal corresponding to open-and-shut action of the molding dies, and supplies air to the air-spraying pipe through the air distributing apparatus.