发明名称 |
METHOD AND DEVICE FOR PROCESSING BRITTLE SUBSTRATE |
摘要 |
<p>PROBLEM TO BE SOLVED: To completely break a brittle substrate by generating fine cullet in a breaking process carried out at the last step in a laser processing machine. SOLUTION: In this invention a brittle substrate is completely broken without forcing external stress by irradiating laser after carrying out a usual processing by laser irradiation and coolant spraying.</p> |
申请公布号 |
JP2001130921(A) |
申请公布日期 |
2001.05.15 |
申请号 |
JP19990308787 |
申请日期 |
1999.10.29 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
ITO AKIRA;UENO TSUTOMU;FUJII MASAHIRO |
分类号 |
B23K26/00;B23K101/42;C03B33/02;C03B33/03;C03B33/09;(IPC1-7):C03B33/02 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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