| 摘要 |
PROBLEM TO BE SOLVED: To enable deposition on a substrate without being affected by the magnitude of plasma density even in positions where rectilinearly forward and backward moving magnets 11 stop and to improve the life of a target 10 with a magnetron sputtering system. SOLUTION: The angle parts of the substrate 12 are arranged in the positions where the rectilinearly forward and backward moving magnets 11 stop and the positions corresponding to the moving ends of the highest plural density. A substrate body is loaded in such a manner that the substrate body is crossed diagonally with the moving direction of the magnets, by which the substrate body from the moving ends.
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