INFRARED RAYS DETECTOR AND FABRICATION METHOD THEREOF

摘要

PURPOSE: An infrared detector and its fabrication method are to improve a degree of sensing an infrared rays by minimizing a thermal noise of an infrared rays detecting unit and to improve a longtime operational reliability. CONSTITUTION: A ceramic package(10) has a top opening part and many projecting outer lead at its outside bottom surface. A thermo electric cooler(70) is disposed at a center of inside bottom surface of the ceramic package. An infrared rays detecting unit(20) is flip-chip bonded to a signal processing IC(30). The signal processing IC die is bonded to the thermo electric cooler by an adhesive(40). A conductive bonding wire(50) electrically connects the bonding pads of the IC to a metal pad(11) which accomplishes a wire bonding of the ceramic package. An infrared rays window(60) is bonded to topside part of the ceramic package to seal the top opening part. A heat sink(80) is bonded to outside surface bottom surface of the ceramic package to maintain a constant temperature of the ceramic package. A sealant(90) seals a through hole(15) of the ceramic package to maintain a state that an inner space of the ceramic package is filled with an inert gas.