| 摘要 |
PURPOSE: A structure of a pad for chemical mechanical polishing is to allow a slurry to flow smoothly and to improve the uniformity and removal rate of polishing, by forming a groove between holes of the pad in an arch shape. CONSTITUTION: A pad used in polishing has through holes and a groove formed between the through holes. The groove is formed in a shape of an arch. The groove contains a lot of slurry. When a wafer is polished using the pad, the slurry flows from each through hole of the pad and is evenly diffused on the entire surface of the pad. The slurry flows toward a center of the groove. The wafer is polished with the pad, with the wafer opposed against to the pad surface. The arch-shaped groove allows the slurry to flow smoothly on the pad surface, so that the uniformity and removal rate of polishing is improved.
|
