| 摘要 |
PURPOSE: To reduce an environmental problem and the load of cost by polishing a device wafer by a first system and polishing and finishing it by a different second system. CONSTITUTION: First and second polishing units 1a and 1b are provided with turn tables 9 where polishing tools are fitted to upper faces, top ring mechanisms 10 holding semiconductor wafers by vacuum adsorption and pressing them to turn table faces and dresser mechanisms 11 resetting fixed abrasive grain polishing tools. In the polishing units, the devices of same specifications among the turn tables, the top ring mechanisms and the dresser mechanisms are basically and symmetrically arranged against transportation lines. The top ring mechanism 10 is provided with a top ring 13 which is positioned above the turn table 9 and presses a semiconductor wafer to the turn table 9 while it is held. The turn table 9 is connected to a motor and it can turn around the shaft center of a shaft.
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