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发明名称
LOW DENSITY HIGH SURFACE AREA COPPER POWDER AND ELECTRODEPOSITION PROCESS FOR MAKING SAME
摘要
申请公布号
KR20010040546(A)
申请公布日期
2001.05.15
申请号
KR1020007008414
申请日期
2000.08.02
申请人
发明人
分类号
C25C5/02
主分类号
C25C5/02
代理机构
代理人
主权项
地址
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