| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient solder sucking device which sucks solder in several through-holes at a time without clogging at a solder sucking mouth. SOLUTION: A solder sucking device providing a structure of sucking solder with negative pressure at a wind tunnel (9) caused by a suction blower (2) and a structure of separating sucked molten solder from a sucking mouth (1) in the vertical direction from air using the sucked inertia and a cyclone effect.
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