发明名称 Encapsulation of printed circuit boards
摘要 A housing for electronic components is injection molded as a unitary, single-piece, monolithic piece, and includes a front cover, a back cover, and a living hinge. Electronic components, including a PCB, are contained within the housing. A cosmetic cover is secured to the housing over the living hinge, which protrudes from the housing, to make the housing more appealing.
申请公布号 US6233155(B1) 申请公布日期 2001.05.15
申请号 US19990324830 申请日期 1999.06.03
申请人 TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) 发明人 MOESTER ERIK;LARSSON PAUL;OLSSON MATS;SIMONSSON OLOF;LARSSON MATS;PORTELA RAFAEL
分类号 H05K5/00;B29C65/08;B29C65/56;B29C65/58;E05D1/02;E05D11/00;H05K5/02;H05K5/03;H05K7/14;(IPC1-7):H05K5/00 主分类号 H05K5/00
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