WAFER INTEGRATED RIGID SUPPORT RING

摘要

PURPOSE: To provide a shadow mask for sticking a solder bump which comprises an additional dummy hole adjacent to a hole corresponding almost to the peripheral chip of a wafer. CONSTITUTION: An additional dummy brings about more even plasma etching for the contact point of a wafer, improves etching at the contact point of a peripheral chip, and lowers the contact resistance at the contact point of peripheral chip. The additional hole also provides the solder bump outside the peripheral chip which is used for supporting a second shadow mask for sticking an additional material such as tin to a re-flowed solder bump, so that the tip is fitted to a plastic substrate at a low temperature. An improved conformity assisting mechanism of a mask to a wafer is formed of a standard solder bump. The improved conformity assisting mechanism avoids damage to a test probe for improved rough conformity.