| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which gives a cured product excellent in flexibility, soldering heat resistance, heat deterioration resistance, electroless gold plating resistance and is developable by an organic solvent or a dilute alkali solution and suitable for a solder resist and an interlaminar insulating layer. SOLUTION: This resin composition comprises a urethane oligomer (A), obtained by reacting 9,9-bis[4-(2-hydroxyalkoxy)phenyl]fluorine (a) and as an optional component a polyol compound (b) other than component (a) with a polybasic acid anhydride (c-1) bearing two acid anhydride groups in the molecule, a polyisocyanate compound (d) and an ethylenically unsaturated group- containing polyhydroxy compound (e), and a diluent (B). |
