COPPER PLATED CERAMIC BOARD, PELTIER ELEMENT USING THE SAME AND METHOD FOR PRODUCING COPPER PLATED CERAMIC BOARD

摘要

PROBLEM TO BE SOLVED: To greatly improve adhesivity of copper plated layer to conventional ceramic board so as to obtain high reliability of copper plated ceramic board for electronic parts. SOLUTION: This method for producing the copper plated ceramic board is characterized in that the method comprises (1) a first process for forming a dry thin film chromium layer on a ceramic board, (2) a second process for forming a dry thin film gold layer on the thin film chromium layer and (3) a third process for copper plating on the thin film gold layer.