发明名称 CURING-TYPE ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a curing-type adhesive composition having enough adherent time after photoirradiation, excellent in workability, hardly hydrolyzable even at high-humidity/temperature after curing and excellent in durability and reliability. SOLUTION: This curing-type sticking adhesive composition is characteristically obtained by adding 12-22 pts.wt. cationic-polymerizable compound including 10-50 wt.% novolak type epoxy resin having >=40 deg.C softening point based on 100 pts.wt. polyester resin and a photo cationic initiator.
申请公布号 JP2001131519(A) 申请公布日期 2001.05.15
申请号 JP19990311243 申请日期 1999.11.01
申请人 SEKISUI CHEM CO LTD 发明人 MIURA MAKOTO;ISHIZAWA HIDEAKI
分类号 C09J167/02;C09J163/04;C09J187/00;(IPC1-7):C09J167/02 主分类号 C09J167/02
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