发明名称 |
CURING-TYPE ADHESIVE COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To obtain a curing-type adhesive composition having enough adherent time after photoirradiation, excellent in workability, hardly hydrolyzable even at high-humidity/temperature after curing and excellent in durability and reliability. SOLUTION: This curing-type sticking adhesive composition is characteristically obtained by adding 12-22 pts.wt. cationic-polymerizable compound including 10-50 wt.% novolak type epoxy resin having >=40 deg.C softening point based on 100 pts.wt. polyester resin and a photo cationic initiator.
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申请公布号 |
JP2001131519(A) |
申请公布日期 |
2001.05.15 |
申请号 |
JP19990311243 |
申请日期 |
1999.11.01 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
MIURA MAKOTO;ISHIZAWA HIDEAKI |
分类号 |
C09J167/02;C09J163/04;C09J187/00;(IPC1-7):C09J167/02 |
主分类号 |
C09J167/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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