| 摘要 |
A method for product assurance for semiconductor devices having wire bonded die and carrier assemblies comprises "puffing" the arc of each bonded wire individually with a stream of gas to force the wire arc into a substantially vertical plane which is positioned laterally away from adjacent wire arcs. The "puff" may be accomplished by a stream of compressed gas from a nozzle positioned beneath the wire or alternatively, by a vacuum drawn from a nozzle positioned above the wire arc, or by both techniques. The force exerted is sufficient to debond defective bonds, break structurally deficient wires and move debonded wires or broken wire ends away from the die, lead frame and other wires. The method is preferably applied just following wire bonding andlor just prior to encapsulation of the die.
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