| 摘要 |
PROBLEM TO BE SOLVED: To prevent a rise in temperature of a capacitor by forming an air duct on a surface of a cooling fin on the capacitor side and to prevent lowering of performance of the capacitor. SOLUTION: Cooling fins 23 in which semiconductor elements 21 are arranged are arranged side by side and a plurality of electrolytic capacitors 22 are disposed in space part 33 of the cooling fins 23 arranged side by side. On side surfaces of the cooling fins 23 in contact with or adjacent to the electrolytic capacitors 22, plural lines of air ducts 40 are formed. The air ducts 40 are arranged in the vertical direction and air heated by the electrolytic capacitors 22 is discharged upward through the air ducts 40. As a result, the electrolytic capacitors 22 can be cooled without filling the heated air at the inside.
|
