发明名称 SUBSTRATE TREATING DEVICE
摘要 PURPOSE: A substrate treating device is provided to accurately position a substrate carried in the peripheral section treating unit from a coating unit. CONSTITUTION: A peripheral section treating unit, which removes an applied solution from the peripheral section of a substrate(G) after the solution is applied to the substrate(G) by means of a coating unit is provided with a stage(71), on which the substrate(G) is placed and a positioning mechanism(72), which positions the substrate(G) carried onto the stage(71). The positioning mechanism(72) positions the substrate(G) to a prescribed position by pushing the substrate(G) in both directions along the diagonal line of the substrate(G), by means of a pair of rollers(81) which are attached to the Y-shaped front end section of the arm(82) of the mechanism(72), by nearly horizontally moving the arm(82) through the means of a horizontally moving mechanism(84).
申请公布号 KR20010039620(A) 申请公布日期 2001.05.15
申请号 KR20000028049 申请日期 2000.05.24
申请人 TOKYO ELECTRON LIMITED 发明人 HONDA YOICHI;SAKAI MITSUHIRO;SHIMOMURA YUJI;TANAKA SHINOBU
分类号 B65G49/06;G02F1/13;H01L21/00;H01L21/027;H01L21/68;(IPC1-7):G02F1/13 主分类号 B65G49/06
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