发明名称 Cooling apparatus for electronic device
摘要 An apparatus for cooling an electronic device includes a case where a plurality of air intake/exhaust holes through which air passes are formed. A plate type mobile member is installed to vibrate in the case and divides an inner space of the case into an upper space and a lower space. An elastic support film is fixed in the case to support the mobile member and has a bulged portion capable of being elastically deformed. A driving device is provided for vibrating the mobile member. By the vibration of the mobile member, air in the upper and lower spaces of the case is exchanged with outside air through the air intake/exhaust holes so that a heat source is cooled.
申请公布号 US6232680(B1) 申请公布日期 2001.05.15
申请号 US20000480924 申请日期 2000.01.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAE BYOUNG-YOUNG;HONG SOON-KYO;SUNG BU-HYUN;YIM HONG-KYUN;KIM YONG-JUN
分类号 H05K7/20;H01L23/467;(IPC1-7):F04B43/04;H02K33/02 主分类号 H05K7/20
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