| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a metal pattern, by which a fine metal pattern excellent in adhesion of the metal to a substrate can be obtained independently of the kinds of the substrates at a low cost in a simple process and which an be widely utilized in electrical, electronic and communication fields. SOLUTION: The method of forming a metal pattern is a metal pattern forming method based on a micro-stamp method forming a fine structure by the transfer of the pattern by a stamp and is comprised of a step forming a silicon polymer thin having reducible property on the surface of a substrate, then a step treating the substrate with a solution containing a metal salt of a metal having standard redox potential of >=0.54 V in order to deposit a corresponding metal colloid on the surface of the substrate, thereafter a step forming a pattern on the metal colloid layer by the transfer by stamping the pattern to which an alkane thiol stuck, and a step subjecting the film having the pattern to electroless plating, thereby a step that the metal pattern is formed only on a part where the silicon polymer thin film is formed and is free from the pattern of the alkane thiol.
|
