发明名称 Semiconductor device and manufacturing method thereof
摘要 A highly reliable semiconductor device and a manufacturing method thereof are provided, without lowering the mobility of carriers, by increasing the nitrogen concentration of part of a gate insulating film. Nitrogen containing regions containing nitrogen are provided on both end portions of a gate insulating film which is formed into a uniform thickness.
申请公布号 US6232187(B1) 申请公布日期 2001.05.15
申请号 US19990280992 申请日期 1999.03.30
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KUROI TAKASHI;SAYAMA HIROKAZU
分类号 H01L21/8247;H01L21/28;H01L21/336;H01L27/115;H01L29/51;H01L29/78;H01L29/788;H01L29/792;(IPC1-7):H01L21/336;H01L21/425 主分类号 H01L21/8247
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