发明名称 CONDUCTIVE POWDER AND MAKING PROCESS
摘要 PURPOSE: Provided are new and useful conductive particles which include improved heat resistance, improved conductivity and improved conductivity stability, and methods of making them and rubber/plastic compositions containing them. CONSTITUTION: A conductive powder comprises an organic silicon polymer layer and a metal layer are successively formed on surfaces of particles, wherein the metal layer preferably includes a first metal layer and a second metal layer. Another conductive powder comprises a partially or entirely ceramic layer of organic silicon polymer and a metal layer which are successively formed on surfaces of particles, wherein the metal layer preferably includes a first metal layer and a second metal layer. A process for preparing a conductive powder, comprises the steps of (1) treating particles each having a surface with an organic silicon polymer having reducing effect to form a silicon polymer layer on the particle surface; (2) treating the particles with a salt of a metal having a standard oxidation-reduction potential of at least 0.54 volt, thereby depositing a colloid of the metal on the organic silicon polymer layer; (3) and thereafter, treating the particles with an electroless plating solution, thereby depositing a metal layer on the outermost surface of the particles. Another process for preparing a conductive powder, comprises the steps of: (1) treating particles each having a surface with an organic silicon polymer having reducing effect to form an organic silicon polymer layer on the particle surface, (2) treating the particles with a solution containing a salt of a metal having a standard oxidation-reduction potential of at least 0.54 volt, thereby depositing a colloid of the metal on the organic silicon polymer layer, (3) effecting electroless plating on the particles with the metal colloid serving as a catalyst, to deposit a first metal layer on the outer surface of the organic silicon polymer layer, and (4) effecting plating on the particles to form a second metal layer on the first metal layer.
申请公布号 KR20010039599(A) 申请公布日期 2001.05.15
申请号 KR20000025223 申请日期 2000.05.12
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 ARAMATA MIKIO;FUKUSHIMA MOTOO;HAMADA YOSHITAKA;ITO KUNIO;KASASHIMA MASAKI;MORI SHIGERU
分类号 H01B1/12;H01B1/22;H05K3/32;(IPC1-7):H01B1/12 主分类号 H01B1/12
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