IC CHIP MOUNTING STRUCTURE OF ELECTRONIC EQUIPMENT

摘要

PURPOSE: An IC chip mounting structure is to effectively prevent the operation of components from being stopped due to a high heat, by improving an allowable loss performance. CONSTITUTION: An IC chip(2) is mounted onto a circuit board(1) with a predetermined shape of pattern formed thereon. The IC chip is provided with a lead(3) connected to the pattern of the circuit board. The lead is connected to the circuit board by solder. A heat radiating plate(10) is provided under a bottom of the IC chip to radiate the heat generated from the IC chip. To provide the IC chip with the heat radiating plate, a mold of the IC chip is removed by a surface area corresponding to that of the heat radiating plate, and the heat radiating plate is soldered to the circuit board. The heat radiating plate is provided with a ground wire to remove static electricity.