发明名称 |
METHOD FOR MANUFACTURING STORAGE ELECTRODE OF MEMORY DEVICE |
摘要 |
PURPOSE: A method for manufacturing a storage electrode of a memory device is provided to guarantee sufficient capacitance and insulating stability between adjacent storage electrodes, by forming a polysilicon layer for forming the storage electrode while using two layers having different impurity density. CONSTITUTION: The first auxiliary layer for forming a capacitor is stacked after a buried contact(17) is formed. The first auxiliary layer is patterned to form an empty space over the buried contact. The first polysilicon layer(25) doped with high-density impurities is stacked. The second polysilicon layer(27) doped with low-density impurities is stacked. The second auxiliary layer is stacked to fill a remaining space after the first and second polysilicon layers are filled in the empty space. The first and second polysilicon layers stacked on the first auxiliary layer are eliminated by a surface planarization process. The first and second auxiliary layers are etched away. A hemispherical grain(HSG)(31) is formed on the first and second polysilicon layers left and exposed.
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申请公布号 |
KR20010038606(A) |
申请公布日期 |
2001.05.15 |
申请号 |
KR19990046651 |
申请日期 |
1999.10.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
WON, DAE JUNG |
分类号 |
H01L27/108;(IPC1-7):H01L27/108 |
主分类号 |
H01L27/108 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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