| 摘要 |
PURPOSE: An apparatus for coating a wafer is provided to form a flat coating layer, by installing a rotation chuck capable of rotating at a low speed while coating liquid is sprayed from a spraying nozzle, and by installing a control unit for controlling the rotation chuck. CONSTITUTION: Coating liquid is sprayed to the surface of a wafer(2). A rotation rate of a rotating chuck(3) on which the wafer is settled is changed. The wafer can be rotated while the coating liquid is sprayed, so that a coating unit(5) forms a flat coating layer on the wafer. A control unit(14) controls to change the rotation rate of the wafer.
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