发明名称 Method and structure to reduce latch-up using edge implants
摘要 The preferred embodiment of the present invention overcomes the limitations of the prior art and provides a device and method to increase the latch-up immunity of CMOS devices by forming implants at the well edges. The preferred method uses hybrid resist to form these implants at the edges of the N-wells and/or P-wells. The implants reduce the lifetime of minority carriers in the parasitic transistor, and hence reduce the gain of the parasitic transistor. This reduces the propensity of the CMOS device to latch-up. The preferred embodiment method allows these implants to be formed without requiring additional masking steps over prior art methods. Furthermore, the preferred method for forming the implants results in implants that are self aligned to the edges of the wells.
申请公布号 US6232639(B1) 申请公布日期 2001.05.15
申请号 US19980107900 申请日期 1998.06.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BAKER FAYE D.;BROWN JEFFREY S.;GAUTHIER, JR. ROBERT J.;HOLMES STEVEN J.;LEIDY ROBERT K.;NOWAK EDWARD J.;VOLDMAN STEVEN H.
分类号 H01L21/761;G03F7/004;H01L21/8238;H01L27/08;H01L27/092;(IPC1-7):H01L29/76 主分类号 H01L21/761
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