发明名称 Testing Board
摘要 A testing board for testing the electric characteristics of semiconductor integrated circuit elements by applying a voltage to each of the testing electrodes of the semiconductor integrated circuit elements comprises a wiring board having a wiring layer at the surface thereof opposing the semiconductor integrated circuit elements. An elastic sheet is disposed in spaced relation to the opposing surface of the wiring board. Probe terminals are disposed on the surface of the elastic sheet opposing the semiconductor integrated circuit elements to correspond to the testing electrodes. A conductive wire has both end portions joined to the wiring layer of the wiring board and a middle portion spaced from the opposing surface of the wiring board. An elastic member for biasing the conductive wire such that the middle portion of the conductive wire is brought into contact with the probe terminal is disposed between the wiring board and the conductive wire.
申请公布号 US6232791(B1) 申请公布日期 2001.05.15
申请号 US19990353371 申请日期 1999.07.14
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 JITSUMORI KENRO;FURUMOTO KENJI;TANAKA SHOICHI;NAKAYAMA TOMOYUKI;MAI MIKIYA;MURAYAMA TUGIO
分类号 G01R31/26;G01R1/073;G01R31/28;H01L21/66;(IPC1-7):G01R31/26 主分类号 G01R31/26
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