发明名称 METHOD OF ELECTROLESS PLATING SURFACE OF POROUS BODY
摘要 PROBLEM TO BE SOLVED: To provide a method of electroless plating, which is capable of easily forming a plated film only on the surface of a porous body having many pores. SOLUTION: The surface of a porous body 1 having many pores 10 can be plated by this electroless plating method, which is comprised of the filling process of heating a filling material 2 to a temperature of not less than the melting point, then filling the molten filling material 2 into the fine pores 10 of the porous body 1 and solidifying the molten filling material, the treatment process for converting into a catalyst of subjecting the surface of the porous body 1 to sensitization treatment and activation treatment, the filling material removing process of removing the filling material 2 filled in the porous pores 10 and the plating process of dipping the porous body 1 into a plating bath and forming a plated film 4 on the surface of the porous body 1.
申请公布号 JP2001131756(A) 申请公布日期 2001.05.15
申请号 JP19990311094 申请日期 1999.11.01
申请人 TOYOTA CENTRAL RES & DEV LAB INC 发明人 TAKEUCHI TSUGUTO;TAKATORI KAZUMASA;UOSHIMA TSUNEKO;KAMIYA NOBUO;KAMITORI TOSHIO
分类号 B01D46/00;B01J37/02;C04B41/88;C23C18/16;C23C18/20;(IPC1-7):C23C18/16 主分类号 B01D46/00
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