| 摘要 |
PURPOSE: A packaging device is to minimize an influence of a signal connection line by perforating a hole in a substrate and filling the hole with a conductive material and to reduce a size of the total package of an MMIC module. CONSTITUTION: An MMIC(monolithic microwave IC) module(10) is formed by integrating a circuit for processing a high frequency signal into a semiconductor. On a planar insulating plate of ceramic, insulating metal or epoxy resin, a hole(72,74) is perforated at a position similar to a position of an input/output terminal of the MMIC module. After the perforated hole is filled with a conductive material, firing at a high temperature is made. A pad(30,35) of conductive material is formed on an upper surface and a bottom surface of the hole. The MMIC module is mounted to a substrate(70) having many pads by an epoxy or a soldering. A signal input/output terminal of the MMIC module comprises a conductive wire(40) and a package cover(60) for preventing the MMIC module and the conductive wire from the exterior mechanical action. The conductive wire electrically connects a conductive pad(30) formed on a signal hole(72) connected to exterior through the conductive material in the perforated hole.
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