| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card wherein surfaces of a thin IC card are smoothly finished by a simple process to improve the design thereof and the usability thereof is improved. SOLUTION: In the method for manufacturing an IC card, a hot-melt adhesive layer, in which an IC module is buried, is superposed on a base material comprising a resin film molded into a planar shape having a thickness larger than that of the IC module. |
