| 发明名称 |
Electroplating process |
| 摘要 |
A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then dried by passing the substrates between opposing resilient rollers and preferably passed an air knife.
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| 申请公布号 |
US6231619(B1) |
申请公布日期 |
2001.05.15 |
| 申请号 |
US19950570633 |
申请日期 |
1995.12.11 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
FLORIO STEVEN M.;BURRESS JEFFREY P.;COLANGELO CARL J.;COUBLE EDWARD C.;KAPECKAS MARK J. |
| 分类号 |
C23C24/00;C23C28/00;C25D5/54;H05K3/18;H05K3/24;H05K3/42;(IPC1-7):C25D5/02 |
主分类号 |
C23C24/00 |
| 代理机构 |
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代理人 |
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