TOOL FOR MACHINING SILICON AND ITS MANUFACTURING METHOD, AND MACHINING METHOD USING THE TOOL

摘要

PROBLEM TO BE SOLVED: To provide a tool for machining silicon using silica abrasive grains, causing mechanochemical action on silicon without forming a reaction product that is a contamination on silicon, and to provide its manufacturing method and a machining method using the tool. SOLUTION: A binder resin (a mixture) including the silica abrasive grains is obtained by adding silica, together with an additive such as a solid lubricant if necessary, into a liquid resin, and stirring and mixing it. An abrasive grain rate of silica is set to 10-70 vol.%, while an average grain diameter of the silica grains is set to 0.8 nm to 10μm. Then a grinding wheel 1 composed of the silica abrasive grains is obtained by a grinding wheel formation method suitable for each the binder and is mounted on a grinding part 10 of a machining machine to grind a silicon wafer 2.