发明名称 Single-piece molded module housing
摘要 An adapter or housing for a module, such as a single in-line memory module (SIMM) or the like, and method of using the same are herein disclosed where the SIMM and attached housing fit a predetermined shape SIMM socket. The housing replaces SIMM board material that would otherwise be used to help secure the SIMM to a predetermined shape SIMM socket or connector. The configuration of the housing allows a SIMM or the like to be snapped or slid and secured into the housing. If desired, an adhesive, potting material and other bonding material can be used to secure the SIMM board to the housing and/or pot the SIMM within the housing.
申请公布号 US6233154(B1) 申请公布日期 2001.05.15
申请号 US19980205872 申请日期 1998.12.04
申请人 MICRON TECHNOLOGY, INC. 发明人 FARNWORTH WARREN M.;KING JERROLD L.
分类号 H01R12/16;H05K1/14;H05K3/28;H05K3/30;(IPC1-7):H05K7/14 主分类号 H01R12/16
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