| 摘要 |
PURPOSE: Tape for forming an external terminal is provided to improve productivity by simplifying a process for forming an external terminal of a chip formed in a wafer which is not sawed, and to reduce a thickness of the wafer by reducing stress applied to the wafer. CONSTITUTION: External terminals of a metal material are bonded to a wafer, which is not sawed, the wafer having a plurality of chips. The external terminals of the metal material are altogether formed on the chips of the wafer. A hole corresponding to a metal pad portion of the bonded chip is formed. The hole has the same size and shape as the bonded wafer, which is not sawed. A metal terminal pattern(1) is formed on one side surface of a base film(3). An adhesion layer(4) is formed on the other side surface of the base film. |
