| 摘要 |
PURPOSE: To prevent a copper pad from being oxidized during processes where a tape is pasted on a wafer and a chip is bonded to a lead frame or the like. CONSTITUTION: This assembly method comprises an anti-oxidizing tape pasting process where an anti-oxidizing tape 2 is pasted on the surface of a wafer 1 where pads are formed of copper or copper alloy, a dicing process where a dicing tape 3 is pasted on the rear of the wafer 1, grooves 4 are provided in the wafer 1 by dicing, and the wafer 1 is divided into semiconductor chips 5 with the anti-oxidizing tape, and a die bonding process where the semiconductor chip 5 with the anti-oxidizing tape 2 is bonded to the lead frame or the like. |
