| 摘要 |
PURPOSE: A soldering pin assembly structure for heat sink is provided to achieve a stable operation of the product by improving the coupling state between the heat sink and PCB. CONSTITUTION: A soldering pin(1) has two punching holes(4) and a protrusion(7), and a heat sink(2) has two protrusions(5) corresponding to the punching holes of the soldering pin. The protrusion of the soldering pin to be mounted into an eyelet(6) of a PCB(3), has a round cross section so as to extend the area welded to the eyelet of the PCB. Since the protrusions of the heat sink and the punching holes of the soldering pin are coupled without gap, and the welded area between the soldering pin and the eyelet of the PCB is increased by the round protrusion of the soldering pin, an improved coupling state between the heat sink and the PCB is obtained.
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