| 摘要 |
PURPOSE: An apparatus for heating a wafer is provided to control wafer defects in a soft bake process and a hexa methylene disilazane(HMDS) process, by preventing the wafer from being uniformly heated to obtain a uniform temperature distribution. CONSTITUTION: Heat transfer fluid is filled up inside a heating body(102) in which a wafer(12) to be heated is settled. A heating plate(100) is formed inside the heat transfer fluid to heat the heat transfer fluid. A circulation pump(105) is installed in the heating body to circulate the heat transfer fluid heated by the heating plate so that the heat of the heat transfer fluid is uniformly transferred to a settling plate.
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