发明名称 |
METHOD OF MEASURING JUNCTION TEMPERATURE OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: A method of measuring junction temperature of a semiconductor device is to measure the junction temperature in various operating modes and a high speed operation of an input/output drive circuit of a semiconductor device using a diode property. CONSTITUTION: A portion having a current-voltage property of a diode(51) is limited at an inner portion of a semiconductor device. A temperature variation index K is measured in the limited portion according to a voltage change. A desired intensity of measuring current(52) is applied to the limited portion to measure an initial voltage and a last voltage. Junction temperature is measured using the measured value. A full-down transistor having ESD(electro static discharge) structure is used as a portion having a diode property. The initial voltage is indicated by the measuring current applied before the full-down transistor is operated in an active state. The last voltage is indicated by the measuring current applied after the full-down transistor is changed from the active state to a saturated state. A temperature changing value is calculated by multiplying the temperature changing index and a difference value between the initial voltage and the last voltage.
|
申请公布号 |
KR20010037941(A) |
申请公布日期 |
2001.05.15 |
申请号 |
KR19990045702 |
申请日期 |
1999.10.21 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
LEE, GIL JAE;NOH, SEUNG GWON |
分类号 |
H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|