发明名称 Multi-layer interconnect
摘要 Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good cells are removed from the panels, and new panels created entirely of identified/known good cells allow increases in the number of layers used in a HDI without incurring the decrease in yield normally associated with such a layering process.
申请公布号 AU1447401(A) 申请公布日期 2001.05.14
申请号 AU20010014474 申请日期 2000.10.31
申请人 ALLIED-SIGNAL INC. 发明人 RICHARD POMMER;BRAD BANISTER;SIMON MCELREA
分类号 H01L21/48;H01L21/66;H01L23/498;H01L23/538;H05K1/02;H05K1/14;H05K3/00;H05K3/22;H05K3/46 主分类号 H01L21/48
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