发明名称 RESIN FILM FOR COATING METALLIC THIN PLATE, RESIN FILM- COATED METALLIC THIN PLATE AND SHEATHING CASE FOR ELECTROLYTIC CAPACITOR
摘要 PROBLEM TO BE SOLVED: To obtain the subject film slight in discoloration tendency even if exposed to high temperatures, to obtain a metallic thin plate coated with the above resin film hard to cause debonding of the film and metallic thin plate from each other at the interface therebetween even if subjected to drawing or caulking work or the like, and to obtain a sheathing case for electrolytic capacitors by using the above resin film-coated metallic thin plate. SOLUTION: This resin film is intended for coating at least one side of a metallic thin plate therewith, comprising (A) 50-95 wt.% of a noncrystalline polyamide and (B) 50-5 wt.% of a straight-chain aliphatic polyamide and being 5-50μm in thickness. The 2nd objective resin film-coated metallic thin plate is obtained by coating at least one side of a metallic thin plate with the above polyamide-based resin film. The 3rd objective sheathing case for electrolytic capacitors is obtained by using the above resin film-coated metallic thin plate.
申请公布号 JP2001131310(A) 申请公布日期 2001.05.15
申请号 JP19990316491 申请日期 1999.11.08
申请人 MITSUBISHI PLASTICS IND LTD 发明人 WAKAYAMA YOSHIO
分类号 C08J5/18;B32B15/08;B32B15/088;C08L77/00;(IPC1-7):C08J5/18 主分类号 C08J5/18
代理机构 代理人
主权项
地址