| 摘要 |
PROBLEM TO BE SOLVED: To prevent the soiling or the like of an inner lead caused by filament like paste at the time of pulling up a discharge nozzle after coating a paste for die bonding. SOLUTION: The tip of the discharging nozzle 4a existing at a stand-by position H0 is lowered to a discharging position H1 close to a substrate (lead frame) placed at a coating work position by a transporting means to discharge paste 10, and after the paste 10 is discharged, is raised to an intermediate position H2 the discharging position H1 by a prescribed length. The discharging nozzle 4a is then finely vibrated until the filament like part of the paste is cut off or sufficiently made narrow, and after the filament like part of the paste is cut off or sufficiently made narrow, the tip part of the discharging nozzle 4a is raised from the intermediate position H2 to the stand-by position H0.
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