| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame which is capable of coping with a resin-sealed semiconductor device that is high in reliability and required to operate at a high speed and a resin-sealed semiconductor device equipped with the above lead frame. SOLUTION: All the surface of a lead frame 1 of 42 alloy is plated with copper as thick as 3μm or below, and furthermore the tips of leads 12 are plated with silver for bonding. Fine needle crystals reside on the surface of a copper-plated part, and the average roughness of needle crystals at ten points ranges from 1,500 to 2,500 nm.</p> |
