| 摘要 |
The invention concerns an optical semiconductor housing (10) and a method for making such an optical housing, wherein an electrical connection support plate has a through passage (37), a semiconductor component (34) whereof one front face (33) comprises an optical sensor and is fixed on a rear face of said plate such that its optical sensor is located opposite said through passage, electrical connection means (38) connect said optical component to said support plate, means (39) encapsulate said component on the rear face of said support plate, a cover (50) at least partly transparent is fixed on a front face of said support plate and covers said through passage, and external electrical connection means (51) are arranged on an exposed part of said support plate. In addition, another semiconductor component (41) can be fixed on the rear face of said support plate and electrically connected (43) thereto, said component being likewise encapsulated (49).
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