| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a solution capable of simultaneously satisfying all restricting conditions is not always found out because the degree of freedom is too high when a final bonding position is determined in the state that a pad position is undefined in an LSI pad position design problem. SOLUTION: An optimum arrangement determination device 1 is provided with a parameter setting part 5 for receiving previously set arrangement boundary information or the like and outputting an arrangement design parameter and a solution candidate generation parameter, a pad arrangement recommended area calculation part 6, a pad temporary position determination part 7, and a bond arrangement enabled area calculation part 8, a bond temporary position determination part 9, a restriction sufficiency evaluation part 10 and a parameter changing part 11 for changing set contents when there is contravention of restriction.
|
