| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the manufacturing method of chip-scale packages, which facilitates handling of a semiconductor device at the time when a transfer treatment of the device is performed while a request for a miniaturization of the device and reduction in the thickness of the device are satisfied. SOLUTION: Bump electrodes are formed on the active surface of an IC water, groove parts are formed in the wafer from the side of the active surface along street lines, a protective resin is applied on the active surface of the wafer, an adhesive member is pasted on the side of the active surface coated with the above protective resin and the wafer is fixed with this adhesive member so as to grind the non-active surface of the wafer until the bottoms of the groove parts are opened on the side of the non-active surface. After the grinding, the adhesive member is removed, an adhesive member is pasted on the ground surface of the wafer and the protective resin is cut along the street lines in a state that the wafer is fixed with this adhesive member. After this, the wafer is contrived so that the wafer is formed separately into individual chip-scale packages by removing the adhesive member pasted on the ground surface.</p> |
