| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of light emitting diode which improves light emitting output by effectively taking out light reflected or absorbed to the rear of an electrode to an outside, and enables an element electrode and an outside electrode to be connected readily. SOLUTION: In a manufacturing method of a light emitting diode, a chip 1 for a light emitting diode wherein a pair of electrodes are formed in one side is arranged in front of a reflection plate 24 of a lead frame 22 wherein the reflection plate 24 which reflects light emitted by the chip 1 is fixed to a tip thereof and electrically connected by a wire 23, and thereafter the chip 1 and the reflection plate 24 are sealed with resin 25. In this method the chip 1 is electrically connected to the lead frame 22 so that one side thereof faces the side of reflection plate 24. |
